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LTC3453
TYPICAL PERFOR A CE CHARACTERISTICS
Efficiency vs LED Current
Output Voltage Ripple
Startup Transient
100
90
FRONT PAGE APPLICATION
P LED /P IN , V IN = 3.6V, T A = 25 ° C
CH1, V OUT
2V/DIV
80
70
20mV/DIV
AC COUPLED
0V
CH2, EN1
1V/DIV
0V
60
5 μ s/DIV
3453 G08
1ms/DIV
3453 G09
FRONT PAGE APPLICATION
FRONT PAGE APPLICATION
50
100 150 200 250 300 350 400 450 500
LED CURRENT (mA)
3453 G07
PI FU CTIO S
V IN = 3.6V
I LED = 150mA
V IN = 3.6V
I LED = 150mA
V IN (Pin 1): Signal Voltage Input Supply Pin [2.7V ≤ V IN ≤
5.5V]. Recommended bypass capacitor to GND is 2.2 μ F
ceramic or larger. Connect to PV IN (Pin 16).
EN1 (Pin 2): Enable Input Pin for I SET1 Current.
I SET1 (Pin 3): White Led Current Programming Pin. A
resistor to ground programs each current source output to
I LED = 384(0.8V/R ISET1 ). This amount of current adds to
any amount set by EN2/I SET2 if also used.
LED1 to LED4 (Pins 4, 6, 7, 9): Individual Low Dropout
Current Source Outputs for White LED Current Biasing.
Connect each white LED between V OUT and an individual
LEDx pin. Unused LEDx outputs should be connected to
V OUT .
GND (Pins 5 and 8): Signal Ground Pin. Connect to PGND
(Exposed Pad).
I SET2 (Pin 10): White Led Current Programming Pin. A
resistor to ground programs each current source output to
I LED = 384(0.8V/R ISET2 ). This amount of current adds to
EN2 (Pin 11): Enable Input Pin for I SET2 Current.
V C (Pin 12): Compensation Point for the Internal Error
Amplifier Output. Recommended compensation capacitor
to GND is 0.1 μ F ceramic or larger.
V OUT (Pin 13): Buck-Boost Output Pin. Recommended
bypass capacitor to GND is 4.7 μ F ceramic.
SW2 (Pin 14): Switching Node Pin. Connected to internal
power switches C and D. External inductor connects
between SW1 and SW2. Recommended value is 4.7 μ H.
SW1 (Pin 15): Switching Node Pin. Connected to internal
power switches A and B. External inductor connects
between SW1 and SW2. Recommended value is 4.7 μ H.
PV IN (Pin 16): Power Voltage Input Supply Pin. Connect to
V IN (Pin 1).
Exposed Pad (Pin 17): Power Ground Pin. Connect to
GND (Pin 8) and solder to PCB ground for optimum
thermal performance.
any amount set by EN1/I SET1 if also used.
3453fa
4
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